2311 Development Hardware Reference Manual Document Number: 12311DHRM Rev.
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Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Chapter 1 Safety Information 1.1 1.1.1 1.1.
Chapter 4 PCB Manufacturing Specifications 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Mask .
About This Book This manual describes Freescale’s 12311-MRB development platform hardware. The MC12311 development platform is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller. Audience This manual is intended for system designers. Organization This document is organized into the following chapters. Chapter 1 Safety Information — Highlights some of the FCC requirements.
Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard CTS Clear to Send DAC Digital to Analog Converter I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.
Chapter 1 Safety Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied.
Safety Information radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.
Chapter 2 MC12311 Development Platform Overview and Description 2.1 Introduction The MC12311 development platform is an evaluation environment based on the Freescale MC12311 device. The MC12311 is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller. This configuration allows users to minimize the use of external components.
MC12311 Development Platform Overview and Description — Standard sockets 100 mils J5 and J4 (2X9 and 2x10) to connect MC12311 and 12311-MRB daughter boards — Standard header 100 mils J1 (2x20) to enable signalling path to TWR primary and secondary connectors.
MC12311 Development Platform Overview and Description • • • • • • • • 2.2.1 Based on Freescale’s low-cost MC12311 sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller, and a functional set of MCU peripherals into a 60-pin LGA package Reference design area with small footprint, low cost RF node — Unbalance input/output port — Flexible RF-Front End for different bands operation — High Sensitivity: down to -120dBm at 1.
MC12311 Development Platform Overview and Description Figure 2-2. Simplified TWR-RF Block Diagram See the TWR-RF Reference Manual for more information about the RF-Tower module. 2.3 Driver Considerations When users first connect a 12311-MRB to a PC, they may be prompted to install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the drivers. Instead, select manual installation and steer Windows to the following directory: C:\Program Files\Fre
Chapter 3 12311-MRB 3.1 12311-MRB Overview The 12311-MRB is an evaluation board based on the Freescale MC12311 device. The 12311-MRB provides a platform to evaluate the MC12311 device, develop software and applications. The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry including SMA for antenna connection and/or instrumentation, and supporting circuitry.
12311-MRB • • 3.1.2 — Regulator bypass jumper option — Separate external voltage source option — Power-on green LED — Jumpers allow various block current measurements 6-Pin BDM serial MCU debug port MC12311 reset switch Form Factor Figure 3-1 shows the 12311-MRB connector and header locations. PA Boost SMA (J1) J8 RFIO ScMA (J2) J3 J4 J6 J9 BDM port (J5) J7 J13 J12 J11 J10 Reset SW Primary 20‐pin IO Connector (J15) Secondary 18‐pin IO Connector (J14) Figure 3-1.
12311-MRB Figure 3-2. 12311-MRB Top Side (Component Side) Footprint 3.1.3 Board Level Specifications Table 3-1. 12311-MRB Specifications Parameter Min Typ Max Units 51 x 51 2.01 x 2.01 mm inches Notes/Conditions General Size (PCB: X, Y) Layer build (PCB) 0.8 0.034 mm 4-Layer inches Dielectric material (PCB) FR4 Power Voltage supply (DC) With 3.3 V regulator in use Current consumption 3.50 10 V TBD mA Full module use 12311 Development Hardware Reference Manual, Rev.
12311-MRB Table 3-1. 12311-MRB Specifications (continued) Parameter Min Typ Max Units Notes/Conditions Operating temperature (see note) -40 +25 +70 °C • Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C.
12311-MRB 3.2 Functional Description The 12311-MRB is built around Freescale’s MC12311 56-pin LGA platform. Figure 3-2 shows a simple block diagram. This board is intended as a simple evaluation platform and as a building block for application development. The 4-layer board provides the MC12311 with its required RF circuitry, 32 MHz reference oscillator crystal, and power supply bypassing. The layout for this base level functionality can be used as a reference layout by the user target board.
12311-MRB The 12311-MRB uses a flexible RF path topology that make it suitable for working in different frequency bands by replacing a minimum number of components while providing good RF performance. The following table shows the different BOM according to different Frequency Bands of operation. NOTE See the MC12311 Data Sheet and Reference Manual for more RF design information. Figure 3-4. 12311-MRB RF Circuitry 3.2.
12311-MRB — The module comes provided with this Y2 crystal and its load capacitors C34 and C35. — Load capacitors C34 and C35 provide the entire crystal load capacitance — The 32 kHz oscillator components are supplied, but un-enabled. Zero-ohm resistors R10 and R11 enable use of IO signals PTB7 and PTB6 via the IO connector — Use J8 to enable crystal signaling to MCU die from the DIO5 or from the 32kHz crystal. Figure 3-5. 12311-MRB 32 MHz Reference Oscillator Circuit Figure 3-6. 12311-MRB 32.
12311-MRB 3.3 Reset and BDM Debug Port The reset circuit and BDM port connector are shown in Figure 3-7. See Figure 3-1 for switch and header locations. • Reset switch SW1 is active low and provides a hardware reset to the MC12311 MCU die and can also provide a RESET to the radio die by adding a jumper to J7. The Reset circuit also includes an LED for monitoring purposes. • The 6-pin BDM 2x3 header J5 is provided to connect the MC1213x serial debug port to a standard HC9S08 debug module. Figure 3-7.
12311-MRB 3.3.1 Power Management The 12311-MRB power management circuit is shown in Figure 3-8. Figure 3-8. 12311-MRB Power Management Circuit Power to the 12311-MRB can be configured in several ways and the circuit has the following features: • Board can be supplied through the IO headers (V_BRD) • Board can be supplied from an external DC supply (J6) — The external supply can be unregulated (V_UNREG) and make use of the onboard 3.
12311-MRB Table 3-2. 12311-MRB Power Configurations Mode Voltage Range External Source J6 Ext Mode Select J9 Source V_BRD 2.7 - 3.6 V1 Not used Not used - all pins open External Source - Using LDO 3.5 - 16 V Connected supplies DC Voltage Short Pins 1-2 Short pins for all desired supplies External voltage w/regulation • Input range is set by the LDO regulator. • 3.
12311-MRB 3.3.2 IO Connectors J2 and J3 The two IO connectors J14 and J15 are standard 100 mil pin headers mounted on the back (non-component side) of the 12311-MRB.The primary header J15 is 20-pin and the secondary header J14 is 18-pin, and they are mounted physically in such a manner as to prevent reverse insertion of the 12311-MRB into a motherboard receptacle (see Figure 3-2).
12311-MRB Table 3-4. 20 Pin Connector (continued) Header Pin Number MC12311 Pin Name 17 PTA0/KBI1P0 Port A Bit 0 / KBI1 Input Bit 0 18 PTA1/KBI1P1 Port A Bit 1 / KBI1 Input Bit 1 19 PTB2/KBI1P2 Port B Bit 2 / KBI1 Input Bit 2 20 PTB3/KBI1P3 Port B Bit 3 / KBI1 Input Bit 3 Description Table 3-5. 18 Pin Connector Header Pin Number MC12311 Pin Name 1 V_BRD 2 PTB7/EXTAL Port B Bit 7 - signal shared with 32.768 kHz oscillator 3 PTB6/XTAL_32K Port B Bit 6 - signal shared with 32.
12311-MRB Figure 3-10. Modular Reference Board PCB Component Location (Top View) Figure 3-11. Modular Reference Board PCB Test Points 12311 Development Hardware Reference Manual, Rev.
12311-MRB Figure 3-12. Modular Reference Board PCB Layout (Top View) Figure 3-13. Modular Reference Board PCB Layout (Bottom View) 12311 Development Hardware Reference Manual, Rev.
12311-MRB 3.4.1 Bill of Materials The following table details the bill of materials. Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number 1 4 BH1,BH2,B 125 H3,BH4 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER 2 3 C1,C7,C23 10PF (DNP) CAP CER 10PF 50V 5% C0G 0402 Avx 04025A100JAT2A 3 2 C5,C6 CAP CER 10PF 50V 5% C0G 0402 Avx 04025A100JAT2A 4 10 C14,C19,C 0.1UF 20,C21,C2 4,C30,C31, C33,C37,C 38 CAP CER 0.
12311-MRB Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number 20 1 J12 961204-6404-A HDR 2X2 TH 100MIL CTR 323H R AU 130L 3m 961204-6404-AR 21 1 J13 HDR_2X4 HDR 2X4 TH 100MIL CTR 330H AU 100L Samtec TSW-104-07-S-D 22 1 J14 HDR 2X9 HDR 2X9 TH 100MIL CTR 330H AU Samtec TSW-109-07-S-D 23 1 J15 HDR_10X2 HDR 2X10 TH 100MIL CTR 330H AU 100L Samtec TSW-110-07-S-D 24 1 L6 33nH IND -- 0.033UH@100MHZ 200MA Toko Inc.
12311-MRB Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number 1 1 C2 3.3pf CAP CER 3.3PF 25V 0.1PF -0402 AVX 04023J3R3BBSTR 2 1 C4 5.6PF CAP CER 5.6PF 50V +/-0.25PF C0G CC0402 MURATA GJM1555C1H5R6CB01D 3 2 C3,C9 6.8PF CAP CER 6.8PF 50V 0.5PF C0G 0402 MURATA GRM1555C1H6R8DZ01J 4 1 C10 47PF CAP CER 47PF 50V 5% C0G 0402 CAL-CHIP GMC04CG470J50NT-LF 5 1 C13 8.2PF CAP CER 8.2PF 50V 0.25PF C0G AVX 0402 04025A8R2CAT2A 6 1 C15 4.
Chapter 4 PCB Manufacturing Specifications This chapter provides the specifications used to manufacture the MC12311 Development hardware printed circuit board (PCB) described in this manual. The MC12311 Development hardware PCBs must comply with the following: • The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.
PCB Manufacturing Specifications Table 4-1. MC12311 Layer by Layer Overview Layer Artwork Identification File Name 1 Silkscreen Top SILK_TOP.art 2 Top Layer Metal TOP.art 3 Ground Layer GND.art 4 Power Layer PWR.art 5 Bottom Layer Metal BOTTOM.art 6 Silkscreen Bottom SILK_BOTTOM.art NOTE The MC12311 contains sub 1 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters.
PCB Manufacturing Specifications • • 4.4 Copper Foil — Top and Bottom copper layers must be 1 oz. copper — Interior layers must be 1/2 oz. copper Plating - All pad plating must be Hot Air Levelling (HAL) Solder Mask The solder mask must meet the following requirements: • Solder mask type: Liquid Film Electra EMP110 or equivalent • Solder mask thickness: 10 – 30 µm 4.
PCB Manufacturing Specifications 4.9 File Description Files included with the download include Design, Gerber and PDF files. Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing. PDF files included are: • FAB-27108.pdf — Board fabrication drawing • GRB-27108.zip — Metal layers, solder mask, solder paste and silk screen • SPF-27108.pdf — Schematic Design files are in Allegro format with OrCAD schematic capture.
