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Table Of Contents
About This Book
Audience
Organization
Revision History
Chapter 1 Safety Information
1.1 FCC Guidelines
1.1.1 Labeling
1.1.2 Operating Conditions
1.1.3 Exposure Limits
1.1.4 Antenna Restrictions
1.2 Regulatory Approval For Canada (IC RSS 210)
1.2.1 26 PART 5 - Appendix
1.3 Electrostatic Discharge Considerations
1.4 Disposal Instructions
Chapter 2 MC12311 Development Platform Overview and Description
2.1 Introduction
2.2 Features
2.2.1 TWR-RF Module
2.3 Driver Considerations
Chapter 3 12311-MRB
3.1 12311-MRB Overview
3.1.1 Features
3.1.2 Form Factor
3.1.3 Board Level Specifications
3.2 Functional Description
3.2.1 RF Performance and Considerations
3.2.2 Clocks
3.3 Reset and BDM Debug Port
3.3.1 Power Management
3.3.2 IO Connectors J2 and J3
3.4 Schematic, Board Layout, and Bill of Material
3.4.1 Bill of Materials
Chapter 4 PCB Manufacturing Specifications
4.1 Single PCB Construction
4.2 Panelization
4.3 Materials
4.4 Solder Mask
4.5 Silk Screen
4.6 Electrical PCB Testing
4.7 Packaging
4.8 Hole Specification/Tool Table
4.9 File Description
1231
1-MRB
1231
1 Development Hardware Reference Manu
al, Rev
. 1
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Freescale Semiconductor
Figure
3-10. Modular Referenc
e Board
PCB Component Location (T
op Vi
ew)
Figure
3-1
1. Modular Reference Board PCB T
est Point
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