User Manual

12311 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor 4-1
Chapter 4
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the MC12311 Development hardware printed
circuit board (PCB) described in this manual.
The MC12311 Development hardware PCBs must comply with the following:
• The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm)
• The PCB manufacturer’s logo is required
• The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (http://www.ul.com/plastics/flame.html)
— The UL information must be stamped on the back of the PCB solder mask
NOTE
• A complete set of design files is available for the 12311 Development
hardware at the Freescale web site (http:www.freescale.com/802154)
under reference designs. It is recommended that this design or one of a
number of other reference designs be used as a starting point for a
custom application.
• The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
4.1 Single PCB Construction
This section describes individual PCB construction details.
• The MC12311 PCB is a four-layer, multi layer designs
• The PCBs contains no blind, buried, or micro vias
• PCB data:
— MC12311 Size: Approximately 51 x 51mm (2.01 x 2.01 inches)
— MC12311 Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding solder mask)
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.