User Manual

Table Of Contents

PCB Manufacturing Specifications

12311 Development Hardware Reference Manual, Rev. 1

4-2 Freescale Semiconductor

NOTE

The MC12311 contains sub 1 GHz RF circuitry. As a result, RF component

placement, line geometries and layout, and spacing to the ground plane are

critical parameters. As a result, BOARD STACKUP GEOMETRY IS

CRITICAL. Dielectric and copper thicknesses and spacing must not be

changed; follow the stackup (see Figure 4-1) information is provided with

the reference design.

Figure 4-1. MC12311 PCB Stackup Cross-Section (Four Layer)

• Solder mask is required

• Silk screen is required

4.2 Panelization

The panel size can be negotiated depending on production volume.

4.3 Materials

The PCB composite materials must meet the following requirements:

• Laminate - The base laminate material (laminate) must be FR4. If the laminate material were

changed the RF electrical characteristics may change and degrade RF performance.

Table 4-1. MC12311 Layer by Layer Overview

Layer Artwork Identification File Name

1 Silkscreen Top SILK_TOP.art

2 Top Layer Metal TOP.art

3 Ground Layer GND.art

4 Power Layer PWR.art

5 Bottom Layer Metal BOTTOM.art

6 Silkscreen Bottom SILK_BOTTOM.art

Dielectric

Metal 1

Metal 2

Metal 3

Metal 4