User's Manual

System Overview and Functional Block Descriptions
1322x-LPB Reference Manual, Rev. 1.1
Freescale Semiconductor 3-3
3.2.1 1322x-LPB Form Factor
The MC1322x allows for very small footprint applications. The 1322x-LPB circuit board illustrates a
small footprint for the MC1322x/RF area and use of a 2 metal layer design. This board can be used as a
template for a 2-layer PCB design (design files are available), or additional reference designs are available
through the Freescale web site.
Freescale provides a one-stop-shop approach to guide customers with their wireless solutions to help
minimize product time-to-market. One important recommendation is to follow the layout application
guide as described in the Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual (ZHDCRM). This manual describes Printed Circuit Board (PCB)
footprint guidelines for the MC1322x LGA 71 package. Included are layouts of the component copper
layer, solder mask, and solder paste stencil.
Figure 3-4. 1322x-LPB PCB Top View
Figure 3-4 shows the 1322x-LPB PCB top view. Refer to this figure in the following sections.
DC
JTAG (J1)
UART (J3)
GPIO (J2)
Power
Connect
Power Switch
SW1
SW2
Power LED
LED 1
LED 2
F-Antenna
J18
J20
J19
J16
J17