322x Sensor Node Reference Manual Document Number: 1322xSNRM Rev. 1.
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Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.1 Supply Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.2 On/Off Switch and Power On Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.3 Power Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
About This Book This manual describes Freescale’s 1322x Sensor Node evaluation board. The 1322x Sensor Node contains Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP). Audience This manual is intended for system designers.
Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard ARM Advanced RISC Machine CTS Clear to Send DAC Digital to Analog Converter DMA Direct Memory Access I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.
Chapter 1 Safety1322x Sensor Node Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied.
Safety1322x Sensor Node Information 1.2.2 47 C.F.R. Sec.15.105(b) This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. This device complies with Part 15 of the FCC Rules. Operation is subject to the following three conditions: 1. This device may not cause harmful interference. 2.
Chapter 2 1322x Sensor Node Module Overview and Description 2.1 Introduction The 1322x Sensor Node is an IEEE 802.15.4 compliant evaluation board based on the Freescale MC1322X device. The heart of the 1322x Sensor Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking.
1322x Sensor Node Module Overview and Description 2.2 Features The 1322x Sensor Node provides the following features: • Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack • Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.
1322x Sensor Node Module Overview and Description — Default 24 MHz crystal reference oscillator (13 to 26 MHz crystal optional) — Reference oscillator can be driven from an external source — Optional 32.768 kHz crystal oscillator for accurate real-time delays (not mounted) 2.3 Board Level Specifications Table 2-1. 1322x Sensor Node Specifications Parameter Units MIN TYP Notes/Conditions MAX General Size (Enclosure: X, Y, Z) Size (PCB: X, Y) Layer build (PCB) 95x60x40 mm 85x50 mm 0.8 / 0.
1322x Sensor Node Module Overview and Description Table 2-1. 1322x Sensor Node Specifications (continued) Parameter Units Range (outdoor / line of sight) 700 Notes/Conditions Meter <1% PER for 20-byte packets (point-to-point in communications with 1322X Sensor Reference Board) RF Transmitter 802.15.4 Output power -30 0 Harmonics 2nd harmonics 3rd harmonics +3 dBm -38 -35 dBm dBm Over range of Pout from IC control in 2 dB steps.
Chapter 3 System Overview and Functional Block Descriptions This section provides an overview of the Sensor Node and block diagrams. 3.1 System Block Diagram The following is the 1322x Sensor Node system level block diagram.
System Overview and Functional Block Descriptions 3.2 System Overview The heart of the 1322x Sensor Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption.
System Overview and Functional Block Descriptions The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides -95 dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry.
System Overview and Functional Block Descriptions • 3.4 Zero-ohm resistors are provided to allow isolation and measurement of various system components (see Section 4.2.3, “Power Measurement”) Low-cost 2.4 GHz ISM Band radio The MC1322x provides an onboard balun, antenna switch, and LNA. The only external component required for the radio is an antenna. The Sensor Node provides a pcb printed metal F-antenna for a complete solution. Figure 3-4 shows the RF network external to the MC1322x.
System Overview and Functional Block Descriptions 3.7 Debug/Development Interface There is a standard JTAG debug port (for pinouts see Section 4.6, “Debug/Development Connector (ARM JTAG Interface)”). A 20-pin connector is provided for a standard JTAG debug interface that only requires a simple interface cable to connect to the PC and uses standard ARM software development tools. 3.8 Sensors The SN provides a temperature sensor, a pressure sensor, and a three axis low-g accelerometer.
System Overview and Functional Block Descriptions 3.8.2 Pressure Sensor The pressure sensor is a Freescale Semiconductor MPXV5010GC6U fully integrated device. It provides a high level analog output signal that is proportional to the applied pressure. Its accuracy is ±5%, and its output voltage is typically 0.200 Vdc at 0 offset pressure with a slope of +450 mV/kPa (1.0 kPa [kiloPascal] equals 0.145 psi.). The sensor requires only one ADC input and is constantly powered .
System Overview and Functional Block Descriptions — The onboard speaker is automatically disconnected if a headset is plugged-in. 3.10 GPIO Connector The GPIO connector (J2) provides a number of data interfaces and GPIO for external system expansion, Section 4.8, “GPIO Connector” gives details. • • • 3.11 Some of the GPIO are shared with onboard devices. The user should take care to avoid conflict. Power supply voltage is provided — Current draw should be limited to 50 mA.
System Overview and Functional Block Descriptions 1322x Sensor Node Reference Manual, Rev. 1.
Chapter 4 Interface Locations and Pinouts This chapter provides a description of the interface location and pinout of the 1322x Sensor Node printed circuit board (PCB). 4.1 Overview This section details the locations (as shown in Figure 4-1) and descriptions of switches, jumpers, and connectors on the 1322x Sensor Node circuit board which is the main board for the 1322x Sensor Node. Users should refer to the figures in the subsequent sections while moving through this chapter.
Interface Locations and Pinouts 4.2 Power Management The module can be powered from the DC power jack, the USB port, or the battery pack. 4.2.1 Supply Sources Table 4-1 lists the supply sources, connectors, and voltages. Board maximum current draw is rated at 100 mA. Table 4-1. Power Supply Sources Source Connector Min (Volts) Typical (Volts) Max (Volts) DC Source J5 4.4 5 12 USB J6 4.4 5 5.25 AA Battery Pack BC1 ~2.0 3 3.2 4.2.2 Notes Use DC only source.
Interface Locations and Pinouts 4.4 USB Connector (“B” Receptacle) The USB connector is designated as J6. Figure 4-2 shows the connector pinout. Figure 4-2. USB Connector Pinout 4.5 LEDs, Switch, Buttons and Joystick The Sensor Node contains a total of four red LEDs and one green LED • The four red LEDs are driven by the MCU and controlled by the software application. • As previously discussed, the green LED is directly connected to the on-board regulation and acts as “Power On” indication.
Interface Locations and Pinouts Table 4-2. Switch and LED Summary (continued) Item 4.6 GPIO Connection Feature SW1 (pushbutton) KBI_4 Interrupt functionality. In parallel with SW6 (right). SW2 (pushbutton) KBI_5 Interrupt functionality. In parallel with SW6 (down). SW3 (pushbutton) KBI_6 Interrupt functionality. In parallel with SW6 (left). SW4 (pushbutton) KBI_7 Interrupt functionality. In parallel with SW6 (up). SW5 (RST) RESETB HW reset SW6 (right) KBI_4 Interrupt functionality.
Interface Locations and Pinouts 4.7 Audio Subsystem Connections The audio subsystem uses the following connections: • 2.5mm stereo jack J3 - for headset mic and earphone • Jumper J7 - selects audio output source. See Figure 4-3 for connections AUD FILTER INPUT J7 1 2 3 1 2 3 SERIAL DAC PWM TSM-103-01-L-SV Audio Select 1-2 DAC 3-2 PWM Figure 4-3. J7 Audio Output Source Jumper 4.8 GPIO Connector The GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 26-pin header.
Interface Locations and Pinouts Table 4-4. GPIO Connector J2 Pinouts (continued) 9 ADC5 ADC Analog Input Channel or GPIO Hardwired to pressure out.
Interface Locations and Pinouts — Test Tool also has the capability to load a new image into the FLASH. NOTE The FLASH must first be cleared before loading a new image. The 1322x Sensor Node has two jumper sites (J19 and J20, Figure 4-4) that must be used to erase the FLASH: 1. Short Jumper J19 Pin 1 to Pin 2 with a shorting bar. 2. Short Jumper J20 Pin 1 to Pin 2 with another shorting bar. 3. Turn on power, push the reset button and wait a few seconds. 4. Turn off power and remove the jumpers. 5.
Interface Locations and Pinouts VCC J18 1 2 HDR_2X1 R1 10K Not Mounted 1.5V U17 1 2 3 4 1 2 3 4 8 7 6 5 8 7 6 5 ADC1_VREFH R120 120K 1% LM285M R121 24.9K 1% Figure 4-5. ADC Voltage 1.5 Vdc Voltage Reference 4.11 Jumper Selection Table 4-5 lists all the possible jumper selections for the Sensor Node. The jumpers available on the board are: • J7 - Selects audio output source • J18 - Sets fixed ADC reference voltage • J19, J20- Clears MC1322x onboard FLASH. See Table 4-5. Table 4-5.
Freescale Semiconductor A B C D TP4 3 4 2 1 R6 390R 5 ADC2 ADC4 DAC_OUT SSI_RX SSI_BITCK SWITCH1 UART2_RX UART2_CTS I2C_SDA SPI_SS SPI_MISO 90122-26 2 4 6 8 10 12 14 16 18 20 22 24 26 J2 1 3 5 7 9 11 13 15 17 19 21 23 25 1 3 5 7 9 11 13 15 17 19 21 23 25 VCC 1 2 HDR_2X1 J20 GPIO Pin Header R71 10K Not Mounted 2 4 6 8 10 12 14 16 18 20 22 24 26 1 2 VCC R9 390R R73 10K VCC 0R R64 VCC 1 2 3 4 4 8 7 6 5 VCC C48 4.7uF LM285M 8 7 6 5 Not Mounted U17 R66 1 2 3 4 1 2 1.
A B C D 5 V_AUD TEMP_OUT V_TMP PRESS_OUT V_PRE G_SLEEP XOUT YOUT ZOUT G-SEL1 G-SEL2 V_XYZ V_AUD V_TMP V_PRE V_PRE 3 4 C31 100nF TP21 R35 1K 1 2 3 V_TMP NC5 NC4 NC3 NC2 NC1 MPXV5010G GND Vo Vs+ Vo GND LM61 17 12 15 14 13 1 2 8 7 6 5 1 4 C30 100nF V_TMP C23 100nF V_PRE MMA7260Q EP SleepMode XOUT YOUT ZOUT g-Select 1 g-Select 2 U3 R74 10K Not Mounted V_XYZ Vs+ U5 U7 Temperature Sensor R31 1K 2 R17 R16 R18 Pressure Sensor C26 100nF TP18 0R 1K 1K 1K R108
A B C 5 USB-B 4 VUSB DataData+ GND SHIELD1 SHIELD2 J6 4 5 6 1 3 2 1 2 3 4 5 6 15pF C42 15pF C43 500mA RT2 SW7-4 MFP461N-RA 1 R50 R51 60OHM L2 0R 0R 2 2 2462 - BC1 C52 10nF C40 100nF TP38 3 C53 4.7uF R40 10K C41 100nF V_USB LT1129CST-3.
Schematic, Board Layout, and Bill of Material Figure 5-4. Sensor Node PCB Component Location (Top View) Figure 5-5. Sensor Node PCB Test Points (Bottom View) 1322x Sensor Node Reference Manual, Rev. 1.
Schematic, Board Layout, and Bill of Material Figure 5-6. Sensor Node PCB Layout (Top View) Figure 5-7. Sensor Node PCB Layout (Bottom View) 1322x Sensor Node Reference Manual, Rev. 1.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number 1 ANT1 F_Antenna PCB F ANTENNA NOT A PART NOT A PART 1 BUZ1 SMD Speaker NDT-03C Star Micronics NDT-03C 1 BC1 PCB Battery Holder 2xAA 2462 Keystone 2462 0 C1,C51,C 54 Ceramic Capacitor 10pF C0G 50V 5% Murata GRM1555C1H100JZ01 2 C14,C32 CAP CER 10UF 6.3V 20% X5R 0603 6.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number 0 C4 Ceramic Multilayer 27nF Capacitor X7R 10V 5% Vishay VJ0402Y273JXQCW1BC 2 C42,C43 Ceramic Capacitor 15pF C0G 50V 5% Murata GRM1555C1H150JZ01J 1 C45 Ceramic Capacitor 220nF X7R 10V 10% Murata GRM188R71A224KA01 1 C46 Ceramic Capacitor 270pF C0G 50V 5% Murata GRM1555C1H271JA01 1 C47 Ceramic Capacitor 3.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance 1 J18 HDR 1X2 TH 100MIL SP 330H AU TSW-102-07-S-S 0 L1 HF Chip coil 3.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference 3 R58,R59, R67 4 Description Fixed resistor RC31 Value Voltage Tolerance Manufacturer Manufacturer Part Number 27K 50V 2% Philips 2322 705 50273 R6,R7,R8, Fixed resistor R9 RC31 390R 50V 2% Philips 2322 705 50391 1 R60 Fixed resistor RC31 8.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number 1 U3 +/-1.
