User's Manual

1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor 6-1
Chapter 6
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the 1323x Development hardware printed
circuit boards (PCB) described in this manual.
The 1323x Development hardware PCBs must comply with the following:
• The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm)
• The PCB manufacturer’s logo is required
• The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (http://www.ul.com/plastics/flame.html)
— The UL information must be stamped on the back of the PCB solder mask
NOTE
• A complete set of design files is available for the 1323x Development
hardware at the Freescale web site (http:www.freescale.com/802154)
under reference designs. It is recommended that this design or one of a
number of other reference designs be used as a starting point for a
custom application.
• The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
6.1 Single PCB Construction
This section describes individual PCB construction details.
• The MRB and RCM PCBs are four-layer, multi layer designs
• The REM PCB is a two layer design
• The PCBs contains no blind, buried, or micro vias
• PCB data:
— MRB Size: Approximately 51 x 51mm (2.01 x 2.01 inches)
— RCM Size: Approximately 86 x 178 mm (3.4 x 7.0 inches)
— REM Size: Approximately 79 x 79 mm (3.1 x 3.1 inches)