User's Manual

PCB Manufacturing Specifications
1323x Development Hardware Reference Manual, Rev. 1.0
6-2 Freescale Semiconductor
— MRB, RCM and REM Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding
solder mask)
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.
The 1323x MRB contains high frequency 2.4 GHz RF circuitry. As a result,
RF component placement, line geometries and layout, and spacing to the
ground plane are critical parameters. As a result, BOARD STACKUP
GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing
must not be changed; follow the stackup (see Figure 6-1) information is
provided with the reference design.
Table 6-1. MRB Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Ground Layer GND.art
4 Power Layer PWR.art
5 Bottom Layer Metal BOTTOM.art
6 Silkscreen Bottom SILK_BOTTOM.art
Table 6-2. RCM Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Ground Layer GND.art
4 Power Layer PWR.art
5 Bottom Layer Metal BOTTOM.art
6 Silkscreen Bottom SILK_BOTTOM.art
Table 6-3. REM Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Bottom Layer Metal BOTTOM.art
4 Silkscreen Bottom SILK_BOTTOM.art