User's Manual

PCB Manufacturing Specifications
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor 6-3
Figure 6-1. MRB PCB Stackup Cross-Section (Four Layer)
• Solder mask is required
• Silk screen is required
6.2 Panelization
The panel size can be negotiated depending on production volume.
6.3 Materials
The PCB composite materials must meet the following requirements:
• Laminate - The base laminate material (laminate) must be FR4. If the laminate material were
changed the RF electrical characteristics may change and degrade RF performance.
• Copper Foil -
— Top and Bottom copper layers must be 1 oz. copper
— Interior layers must be 1/2 oz. copper
• Plating - All pad plating must be Hot Air Levelling (HAL)
6.4 Solder Mask
The solder mask must meet the following requirements:
• Solder mask type: Liquid Film Electra EMP110 or equivalent
• Solder mask thickness: 10 – 30 µm
Dielectric
Dielectric
Dielectric
Metal 1
Metal 2
Metal 3
Metal 4