User's Manual

PCB Manufacturing Specifications
1323x Development Hardware Reference Manual, Rev. 1.0
6-4 Freescale Semiconductor
6.5 Silk Screen
The silk screen must meet the following requirements:
Silkscreen color: White
Silkscreen must be applied after application of solder mask if solder mask is required
The silkscreen ink must not extend into any plated-thru-holes
The silk screen must be clipped back to the line of resistance
6.6 Electrical PCB Testing
All PCBs must be 100 percent tested for opens and shorts
Impedance Measurement - An impedance measurement report is not mandatory
6.7 Packaging
Packaging for the PCBs must be the following requirements:
Finished PCBs must remain in panel
Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
6.8 Hole Specification/Tool Table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-23451.pdf file.
6.9 File Description
Files included with the download include Design, Gerber and PDF files.
Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
FAB-2611x.pdf — Board fabrication drawing
GRB-2611x.pdf — Metal layers, solder mask, solder paste and silk screen
SPF-2611x.pdf — Schematic
Design files are in Allegro format with OrCAD schematic capture.