User's Manual

1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.0
3-4 Freescale Semiconductor
3.1.3 Board Level Specifications
Table 3-1. 1323x-MRB Specifications
Parameter Units Notes/Conditions
MIN TYP MAX
General
Size (PCB: X, Y) 51 x 51
2.01 x 2.01
mm
inches
Layer build (PCB) 0.8
0.034
mm
inches
4-Layer
Dielectric material (PCB) FR4
Power
Voltage supply (DC)
With 3.3 V regulator in use
Not using regulator with serial
FLASH and IR
Not using regulator with
MC1323x only
3.50
2.7
1.8
16
3.6
3.6
V Full module use
Not regulated - using all features
Lower voltage usable only by MC1323x
Current consumption TBD mA
Temperature
Operating temperature (see note) -20 +25 +70 °C • Operating temperature is limited to +70
°C due to switches. Basic circuit is good
for a maximum temperature of +85 °C.
• Operating temperature may also be
further limited when used in conjunction
with REM or RCM having a battery
supplied voltage source. See Ta b l e 4-1
and Table 5-1.
Storage temperature -30 +25 +70 °C
IR Transmitter
Current 63 mA
Range 10 m
RF
802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz band
Range (outdoor / line of sight) 300 Meter <1% PER for 20-byte packets (point-to-point
in communications with 1323x Sensor
Reference Board)
RF Transmitter
802.15.4 Output power -30 0 +3 dBm