Reference Manual

USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 4-1
Chapter 4
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the KW2x Development hardware printed
circuit board (PCB) described in this manual.
The KW2x Development hardware PCBs must comply with the following:
• The PCB must comply with Perfag1D/3C (http://www.perfag.dk/Uk/ukindex.htm)
• The PCB manufacturer’s logo is required
• The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (http://www.ul.com/plastics/flame.html)
— The UL information must be stamped on the back of the PCB solder mask
NOTE
• A complete set of design files is available for the KW2x Development
hardware at the Freescale web site (http:www.freescale.com/KW2x)
under the “Software and Tools” tab. This design or one of a number of
other reference designs should be used as a starting point for a custom
application.
• The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
4.1 Single PCB Construction
This section describes individual PCB construction details.
• The USB-KW24D512 PCB is four-layer, multi layer design
• The PCBs contains no blind, buried, or micro vias
• PCB data:
— USB-KW24D512 Size: Approximately 61.4 x 18.5mm (2.42 x 0.73 inches)
— USB-KW24D512 Final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder
mask)