Reference Manual

PCB Manufacturing Specifications
USB-KW2x Hardware Reference Manual, Rev. 0.1
4-2 Freescale Semiconductor
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.
NOTE
The USB-KW24D512 contains high frequency 2.4 GHz RF circuitry. As a
result, RF component placement, line geometries and layout, and spacing to
the ground plane are critical parameters. As a result, BOARD STACKUP
GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing
must not be changed; follow the stackup (see Figure 4-1) information is
provided with the reference design.
Figure 4-1. USB-KW24D512 PCB Stackup Cross-Section (Four Layer)
• Solder mask is required
• Silk screen is required
4.2 Panelization
The panel size can be negotiated depending on production volume.
4.3 Materials
The PCB composite materials must meet the following requirements:
Table 4-1. USB-KW24D512 Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Ground Layer GND.art
4 Power Layer PWR.art
5 Bottom Layer Metal BOTTOM.art
6 Silkscreen Bottom SILK_BOTTOM.art