Reference Manual

PCB Manufacturing Specifications
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 4-3
• Laminate - The base laminate material (laminate) must be FR4. If the laminate material were
changed the RF electrical characteristics may change and degrade RF performance.
• Copper Foil -
— Top and Bottom copper layers must be 1 oz. copper
— Interior layers must be 1oz. copper
• Plating - All pad plating must be Hot Air Levelling (HAL)
4.4 Solder Mask
The solder mask must meet the following requirements:
• Solder mask type: Liquid Film Electra EMP110 or equivalent
• Solder mask thickness: 10 – 30 µm
4.5 Silk Screen
The silk screen must meet the following requirements:
• Silkscreen color: White
• Silkscreen must be applied after application of solder mask if solder mask is required
• The silkscreen ink must not extend into any plated-thru-holes
• The silk screen must be clipped back to the line of resistance
4.6 Electrical PCB Testing
• All PCBs must be 100 percent tested for opens and shorts
• Impedance Measurement - An impedance measurement report is not mandatory
4.7 Packaging
Packaging for the PCBs must be the following requirements:
• Finished PCBs must remain in panel
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
4.8 Hole Specification/Tool Table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28057.pdf file.