User Manual

Table Of Contents
MKW2xDxxxV Product Electrical Specification, Rev. 0.1
Freescale Semiconductor 19
7 MKW2xDxxxV electrical characteristics
7.1 Recommended operating conditions
7.2 Thermal handling ratings
7.3 Moisture handling ratings
Table 8. Recommended operating conditions
Characteristic Symbol Min Typ Max Unit
Power Supply Voltage (V
BATT
= VDD
INT
)V
BATT,
VDD
INT
1.8 2.7 3.6 Vdc
Input Frequency fin 2.360 2.480 GHz
Ambient Temperature Range TA –40 25 105 C
Logic Input Voltage Low VIL 0 30%
VDDINT
V
Logic Input Voltage High VIH 70%
VDDINT
—VDDINTV
SPI Clock Rate f
SPI
16.0 MHz
RF Input Power Pmax 10 dBm
Crystal Reference Oscillator Frequency (40 ppm over
operating conditions to meet the 802.15.4 Standard.)
fref 32 MHz only
Symbol Description Min. Max. Unit Nots
T
STG
Storage temperature –55 150 C
1
1
Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
T
SDR
Solder temperature, lead-free 260 C
2
2
Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices.
Symbol Description Min. Max. Unit Nots
MSL Moisture sensitivitiy level 3
1
1
Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices.