User Manual

ZSTAR3 Wireless Sensing Triple Axis Reference design Introduction

ZSTAR3 Reference Design Manual, Rev. 0.1

Freescale Semiconductor 2-13

Preliminary

The MC13213 System in Package (SiP) integrates the MC9S08GT MCU with the MC1320x transceiver

into a single 9x9mm LGA package. The MC13213 provides 60 K Flash memory and 4 K of RAM. By

using the IEEE 802.15.4 Compliant MAC, or BeeStack ZigBee Protocol Stack, the MC13213 is an ideal

solution for sensing and control applications that require mesh networking.

Features:

• 40 MHz HCS08 low-voltage, low-power core

• 60 KB Flash and 4KB RAM memory

• Seven addressing modes for CPU

• Multiple 16-bit timers

• 2V to 3.4V operating voltage with on chip voltage

regulator

• -40 to +85 degrees C operating temperature

• Low external component count

• Requires a single 16 MHz crystal

• Programmable frequency clock output for MCU

• Auto-trim feature for crystal accuracy

• Eliminate need for external variable capacitors

• Allows for automated production frequency calibration

• 9x9x1 mm 71-pin LGA package

• RoHS compliant

• Up to 38 GPIO

• 8-bit port keyboard interrupt (KBI)

• 8-channel 10-bit analog-to-digital converter (ADC)

• Two independent serial communication interfaces (SCI) supporting up to 115.2 kBaud

• Inter-integrated circuit (I2C) with 100 kbps maximum bus loading

• Internal clock generator (ICG) at 100 kHz or 16 MHz (including internal reference generator)

• Low-voltage detection

• In-circuit debug and Flash programming available via on-chip background debug module (BDM)

• Programmable low voltage interrupt (LVI)

• Common on-chip processor (COP) watchdog timer

• Operates in the 2.4GHz band

• 250 kbps O-PQSK modulation

• 16 selectable channels

• 0 dBm nominal output power

• Programmable from -27 dBm to +3 dBm

• Receive sensitivity of -92 dBm (typical) at 1% PER

• Integrated transmit/receive switch