Datasheet

ManualsBrandsFreescale ManualsIntegrated Circuits (ICs)Pressure Sensor

MPX4250A

Rev 7, 1/2009

Freescale Semiconductor

Pressure

Integrated Silicon Pressure Sensor

Manifold Absolute Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPX4250A series Manifold Absolute Pressure (MAP) sensor for

engine control is designed to sense absolute air pressure within the intake

manifold. This measurement can be used to compute the amount of fuel

required for each cylinder.

The MPX4250A series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications,

particularly those employing a microcontroller or microprocessor with A/D

inputs. This transducer combines advanced micromachining techniques, thin-

film metallization and bipolar processing to provide an accurate, high-level

analog output signal that is proportional to the applied pressure. The small

form factor and high reliability of on-chip integration make the Freescale

sensor a logical and economical choice for the automotive system engineer.

Features

• 1.5% Maximum Error Over 0° to 85°C

• Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems

• Patented Silicon Shear Stress Strain Gauge

• Temperature Compensated Over -40° to +125°C

• Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules

• Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package

• Ideal for Non-Automotive Applications

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MPXA4250A Series)

MPXA4250A6U

Rail 482

• •

MPXA4250A

MPXA4250AC6U

Rail 482A

• •

MPXA4250A

MPXA4250AC6T1

Tape and Reel 482A

• •

MPXA4250A

Unibody Package (MPX4250A Series)

MPX4250A

Tray 867

• •

MPX4250A

MPX4250AP

Tray 867B

• •

MPX4250A

Series

20 to 250 kPa (2.9 to 36.3 psi)

0.2 to 4.9 V Output

MPX4250A

UNIBODY PACKAGES

SMALL OUTLINE PACKAGES

MPX4250AP

CASE 867B-04

MPX4250A

CASE 867-08

MPXA4250A6U

CASE 482-01

MPXA4250AC6U/C6T1

CASE 482A-01

Application Examples

• Turbo Boost Engine Control

• Ideally Suited for Microprocessor or

Microcontroller-Based Systems

Summary of content (11 pages)

PAGE 1
Pressure Freescale Semiconductor + MPX4250A Rev 7, 1/2009 Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX4250A Series 20 to 250 kPa (2.9 to 36.3 psi) 0.2 to 4.9 V Output The MPX4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 VDC, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Units POP 20 — 250 kPa Supply Voltage(2) VS 4.85 5.1 5.35 VDC Supply Current IO — 7.0 10 mAdc Differential Pressure Range(1) Minimum Pressure Offset(3) @ VS = 5.1 Volts (0 to 85°C) VOFF 0.133 0.204 0.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure(2) (P1 > P2) PMAX 1000 kPa Storage Temperature TSTG -40 to +125 °C TA -40 to +125 °C Operating Temperature 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 4
Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250A series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media.
PAGE 5
Pressure Transfer Function Nominal Transfer Value: VOUT = VS (P × 0.004 - 0.04) ± (Pressure Error × Temp. Factor × 0.004 × VS) VS = 5.1 V ± 0.25 VDC Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 +125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C. Pressure Error Band 5.0 4.0 Pressure Error (kPa) 3.0 2.0 1.0 0 -1.0 -2.0 -3.0 -4.0 -5.
PAGE 6
Pressure INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to design design. The footprint for the surface mount packages must be boards with a solder mask layer to avoid bridging and the correct size to ensure proper solder connection interface shorting between solder pads. between the board and the package.
PAGE 7
Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B A S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.
PAGE 8
Pressure PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6.
PAGE 9
Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX4250A Sensors Freescale Semiconductor 9
PAGE 10
Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX4250A 10 Sensors Freescale Semiconductor
PAGE 11
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.