User's Manual
Table Of Contents
- About This Document
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 2.1 General Description
- 1.1 Simplified Block Diagram
- 1.2 Features and Application
- 1.3 Evaluation Board
- 1.4 List of Applicable FCC Rules
- 1.5 The Specific Operational Use Conditions
- 1.6 Limited Module Procedures
- 1.7 Trace Antenna Designs
- 1.8 Antennas
- 1.9 Label and Compliance Information
- 1.10 Information on Test Modes and Additional Testing R
- 2 Pin Definitions
- 3 Technical Specifications
- 4 Application Interface
- 5 Application Function
- 6 Data Business
- 7 Mechanical Dimensions
- 8 Appendix
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Figure 8- 5 Bottom view of WSL05-A0 module
These are design effect drawings of WSL05-A0 module. For more accurate pictures, please
refer to the module that you get from Friendcom.
7.3
Packaging
WSL05-A0 modules are packed in vacuum-sealed bags on delivery to guarantee a long
shelf life. The bag should not be opened until the devices are ready to be soldered onto the
application. Follow the same package of the modules again in case of opened for any
reasons.
If exposed to air for more than 48 hours at conditions not worse than 30°C/60% RH, a
baking procedure should be done before SMT. Or, if the indication card shows humidity
greater than 20%, the baking procedure is also required. Do not bake modules with the
package tray directly.