Datasheet
4 Datasheet
5.2.2 Thermal Monitor 2 ..................................................................................78
5.2.3 On-Demand Mode...................................................................................79
5.2.4 PROCHOT# Signal ..................................................................................80
5.2.5 THERMTRIP# Signal................................................................................80
5.3 Thermal Diode...................................................................................................81
5.4 Platform Environment Control Interface (PECI) ......................................................83
5.4.1 Introduction...........................................................................................83
5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management .......83
5.4.2 PECI Specifications .................................................................................85
5.4.2.1 PECI Device Address..................................................................85
5.4.2.2 PECI Command Support.............................................................85
5.4.2.3 PECI Fault Handling Requirements...............................................85
5.4.2.4 PECI GetTemp0() Error Code Support ..........................................85
6Features..................................................................................................................87
6.1 Power-On Configuration Options ..........................................................................87
6.2 Clock Control and Low Power States.....................................................................88
6.2.1 Normal State .........................................................................................88
6.2.2 HALT and Extended HALT Powerdown States..............................................88
6.2.2.1 HALT Powerdown State ..............................................................89
6.2.2.2 Extended HALT Powerdown State ................................................89
6.2.3 Stop Grant and Extended Stop Grant States...............................................89
6.2.3.1 Stop-Grant State.......................................................................90
6.2.3.2 Extended Stop Grant State.........................................................90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant
Snoop State, and Stop Grant Snoop State..................................................90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......91
6.3 Enhanced Intel SpeedStep® Technology...............................................................91
7 Boxed Processor Specifications................................................................................93
7.1 Mechanical Specifications....................................................................................94
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................94
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................96
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....96
7.2 Electrical Requirements ......................................................................................96
7.2.1 Fan Heatsink Power Supply ......................................................................96
7.3 Thermal Specifications........................................................................................98
7.3.1 Boxed Processor Cooling Requirements......................................................98
7.3.2 Fan Speed Control Operation (Intel
®
Pentium
®
Dual-Core Desktop
Processor E2000 Series)........................................................................100
8 Debug Tools Specifications ....................................................................................103
8.1 Logic Analyzer Interface (LAI) ...........................................................................103
8.1.1 Mechanical Considerations .....................................................................103
8.1.2 Electrical Considerations........................................................................103