Datasheet

8Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families
Datasheet Volume One of Two
Tables
1-1 HCC, MCC, and LCC SKU Table Summary..............................................................11
1-2 Volume Structure and Scope ...............................................................................14
2-1 Summary of Processor-specific PECI Commands ....................................................34
2-2 Minor Revision Number Meaning ..........................................................................37
2-3 GetTemp() Response Definition ...........................................................................38
2-4 RdPkgConfig() Response Definition.......................................................................40
2-5 WrPkgConfig() Response Definition ......................................................................42
2-6 RdPkgConfig() & WrPkgConfig() DRAM Thermal and Power Optimization
Services Summary.............................................................................................43
2-7 Channel & DIMM Index Decoding .........................................................................45
2-8 RdPkgConfig() & WrPkgConfig() CPU Thermal and Power Optimization
Services Summary.............................................................................................50
2-9 Power Control Register Unit Calculations ...............................................................55
2-10 RdIAMSR() Response Definition ...........................................................................66
2-11 RdIAMSR() Services Summary12 .........................................................................67
2-12 RdPCIConfig() Response Definition.......................................................................69
2-13 RdPCIConfigLocal() Response Definition ................................................................71
2-14 WrPCIConfigLocal() Response Definition................................................................72
2-15 WrPCIConfigLocal() Memory Controller and IIO Device/Function Support...................73
2-16 PECI Client Response During Power-Up.................................................................74
2-17 SOCKET ID Strapping.........................................................................................75
2-18 Power Impact of PECI Commands vs. C-states.......................................................75
2-19 Domain ID Definition..........................................................................................78
2-20 Multi-Domain Command Code Reference...............................................................78
2-21 Completion Code Pass/Fail Mask ..........................................................................79
2-22 Device Specific Completion Code (CC) Definition ....................................................79
2-23 Originator Response Guidelines............................................................................80
2-24 Error Codes and Descriptions...............................................................................81
4-1 System States...................................................................................................91
4-2 Package C-State Support ....................................................................................91
4-3 Core C-State Support .........................................................................................92
4-4 System Memory Power States .............................................................................92
4-5 DMI2/PCI Express* Link States............................................................................93
4-6 Intel® QPI States ..............................................................................................93
4-7 G, S and C State Combinations............................................................................93
4-8 P_LVLx to MWAIT Conversion ..............................................................................96
4-9 Coordination of Core Power States at the Package Level..........................................98
4-10 Package C-State Power Specifications................................................................. 101
4-11 Processor Package Power Pmax .........................................................................101
5-1 TCase Temperature Thermal Specifications.......................................................... 109
5-2 Digital Thermal Sensor (DTS) Specification Summary ........................................... 110
5-3 Embedded TCase Temperature Thermal Specifications ..........................................113
5-4 Embedded DTS Thermal Specifications ............................................................... 115
6-1 Memory Channel DDR0, DDR1, DDR2, DDR3 ....................................................... 123
6-2 Memory Channel Miscellaneous..........................................................................124
6-3 PCI Express* Port 1 Signals .............................................................................. 124
6-4 PCI Express* Port 2 Signals .............................................................................. 124
6-5 PCI Express* Port 3 Signals .............................................................................. 125
6-6 PCI Express* Miscellaneous Signals....................................................................125
6-7 DMI2 and PCI Express Port 0 Signals.................................................................. 126