User's Manual
Table Of Contents
- Table of Contents
- Chapter 1 About This Manual
- Chapter 2 GS2011M Overview
- Chapter 3 GS2011M Architecture
- Chapter 4 Pin-out and Signal Description
- Chapter 5 Electrical Characteristics
- Chapter 6 Package and Layout Guidelines
GS2011M Overview GS2011M Low Power WiFi Module Data Sheet
GS2011M Module Product Features
16 Confidential Preliminary GS2011M-DS-001211, Release 0.9
• WiFi Solution:
– WiFi security (802.11i):
– WPA™ - Enterprise, Personal
– WPA2™ - Enterprise, Personal
– Vendor EAP Type(s):
– EAP-TTLS/MSCHAPv2, PEAPv0/EAP-MSCHAPv2,
PEAPv1/EAP-GTC, EAP-FAST, EAP-TLS
• Hardware-accelerated high-throughput AES and RC4 encryption/decryption
engines for WEP, WPA/WPA2 (AES-CCMP and TKIP).
• Additional dedicated encryption HW engine to support higher layer encryption
such as IPSEC (IPv4 and IPv6), SSL/TLS, HTTPs, PKI, digital certificates, RNG,
etc.
• Dual ARM Cortex M3 Processor Platform:
•1
st
Cortex M3 processor (WLAN CPU) for WLAN software
– Implements 802.11 b/g/n WLAN protocol services
– 320 KB dedicated SRAM
– 512 KB dedicated ROM
•2
nd
Cortex M3 processor (APP CPU) for networking software
– Implements networking protocol stacks and user application software
– 384 KB dedicated SRAM
– 512 KB dedicated ROM
• 64KB shared dual ported SRAM for inter-processor communications
• 320 KB assignable (under SW control) SRAM
• Support processor clock frequencies for both CPU of up to 120MHz
• Based on Advanced Microprocessor Bus Architecture (AMBA) system:
– AMBA Multilayer High-Speed Bus (AHB)
– AMBA Peripheral Bus (APB)
• On-module controller
– Manages read/write/program/erase operations to the 4 MB flash memory
device on the module
– Supports higher performance QUAD SPI protocol operations
– Active power management
• Interfaces:
• SDIO: