Instruction Manual

Data Sheet

SHHD003A0A Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 5.0Vdc, 3A, 15W Output

Surface Mount Information (continued)

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C

(Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices) for both Pb-free solder

profiles and MSL classification procedures. This standard

provides a recommended forced-air-convection reflow profile

based on the volume and thickness of the package (table 4-2).

The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The

recommended linear reflow profile using Sn/Ag/Cu solder is

shown in Figure 22.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit board

assembly process prior to electrical board testing. The

result of inadequate cleaning and drying can affect both the

reliability of a power module and the testability of the

finished circuit board assembly. For guidance on

appropriate soldering, cleaning and drying procedures, refer

to Lineage Power Board Mounted Power Modules:

Soldering and Cleaning Application Note (AN04-001).

Layout Recommendations

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

SMT Layout

Through Hole Layout