GE Inspection Technologies Solder joint inspection and analysis with GE’s phoenix|x-ray microfocus and nanofocus X-ray systems
FAQs about X-ray How X-ray inspection source small FOD large FOD works object FDD detector high magnification low magnification insulator UH UG cathode (filament) UACC grid anode deflection unit How X-ray tubes What makes an excellent work X-ray? The heart of the X-ray machine is an elec- One of phoenix|x-ray’s key technology com- trode pair consisting of a cathode, the fila- petencies are tube and generator design and ment, and an anode, that is located inside a manufacturing ensurin
The View Inside Why to inspect solder joints with X-ray? The reliability of electronic assemblies strongly depends on solder joint quality. Acceptability criteria are mainly based on shape and dimension of the solder joints. As quality demands and technology for assembly process for new package types increase, many solder joints are no longer directly visible. Fortunately, they can easily be inspected by advanced microfocus and nanofocus X-ray systems.
The Third Dimension Just look from the side ovhm - oblique views at highest magnification Some acceptability criteria refer to a side view and many defects can be seen best from the side, in other words, some information about the vertical dimension is required. phoenix|x-ray systems provide this information by oblique view – up to 70 degrees – at highest magnification. As an example, this enables the user to see open BGA solder joints directly instead of interpreting signatures.
Automated Inspection The efficient way of process control and rework Efficient soldering process control requires the acquisition of statistical data on the solder joints of a larger number of samples. phoenix|x-ray offers a range of plug-in software modules for the automated evaluation of standard solder joints like BGA, QFP, QFN, or PTH. For non-typical interconnections, appropriate modules can quickly be customised with the XE² (X-ray image Evaluation Environment) software.
Anticipating the Future Inspecting the smallest and finest nanofocus and digital imaging Miniaturization and new assembly techniques demand resolution in the submicron range and also highest contrast resolution. With the nanofocus tube technology together with digital image chains or fully digital detector arrays, 40 micron solder bumps at nanofocus resolution phoenix|x-ray provides proven detail detectability down to 200 nm (0.2 microns) combined with superior contrast resolution.
Systems GE’s phoenix|x-ray business offers a wide range of systems and system configurations dedicated to various 2D and 3D inspection tasks in printed circuit board assembly: phoenix nanome|x phoenix nanotom s and m the ultimate nanofocus X-ray solution outstanding spatial and contrast resolution on a wide sample range This automated X-ray system with superior specifications satisfies even the highest Both versions of the nanotom come stan- demands: The 180 kV / 15 W high-power dard with a 180 kV /
Regional Contact Information Europe, Asia, Africa, South America GE Sensing & Inspection Technologies Niels-Bohr-Str. 7 31515 Wunstorf P.O. Box 6241 31510 Wunstorf Germany Tel.: +49 5031 172 0 Fax: +49 5031 172 299 E-mail: phoenix-info@ge.com phoenix-asia@ge.com Americas GE Inspection Technologies, LP 50 Industrial Park Rd Lewistown, PA 17044 USA Tel.: +1 (717) 242 0327 Fax: +1 (717) 717 242 2606 E-mail: phoenix-usa@ge.com www.ge-mcs.com/phoenix GEIT-31101EN (11/11) © 2011 General Electric Company.
