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Integration. Documentation. Validation.
Qualification. Minus the aggravation.
Functional Testing
Each subsystem is subjected to a Functional
Test (FT) several times during the qualifica-
tion test procedure. The FT will most often
be an automated process, but may include
some user intervention.
Thermal Design and
Qualification Processes
Early in the design process, thermal analy-
sis is conducted using computer modeling.
The models simulate worst case thermal
environments for the chassis and its subas-
semblies. The models characterize junction
temperatures of suspect components and
may suggest enhancements to layout to
increase the probability of high tempera-
ture survival.
Shock and Vibration Analysis
and Qualification
The goal of shock and vibration test-
ing is primarily to simulate qualification
level vibration and shock environments
on chassis and subassemblies in order to
identify potential failures. In addition, we
are able to use test information as a basis
for future design enhancements.
EMI Qualification
Systems are subjected to electromagnetic
interference and susceptibility tests by an
approved sub-contractor. The tests typically
include Electromagnetic Compatibility (EMC);
Electromagnetic Interference (EMI); control
and dissipation of electrostatic charges;
preclusion of an Electromagnetic Radiation
Hazard (EMRADHAZ); and proper electrical
bonding for MIL-STD-464.
Engineering Development Units
Once the subsystem requirements have
been decided upon, we are able to provide
engineering development units (EDUs) which
facilitate early software development.
EDUs are developed to customer speci-
fications including a full complement of
representative conduction cooled boards
with the appropriate connectors or rear
transition modules.
Each part of a rugged subsystem must be tested to conform to the customer’s requirements.
Thermal modeling is one of the methods used
to qualify chassis and subassemblies.