User's Manual

BGS2-E/BGS2-W Hardware Interface Overview
5.5 Pad Assignment
26
BGS2_HIO_v01.300 Page 24 of 29 2011-03-08
Confidential / Released
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5.5 Pad Assignment
The SMT application interface on the BGS2-E/BGS2-W provides connecting pads to integrate
the module into external applications. Figure 1 shows the connecting pads’ numbering plan,
the following Table 15 lists the pads’ assignments.
Figure 1: Numbering plan for connecting pads (bottom view)
53
65
64
63
62
61
60
59
58
57
56
55
54
66
33
21
22
23
24
25
26
27
28
29
30
31
32
20
107
1009998979695949392
83 84 85 86 88 89 90 91
828180797877767574
73727170696867
106105104103102101
87
44
19181716151413121110987654321
343536373839404142434546474849505152
Supply pads: BATT+
Control pads
GND pads
Analog audio pads
ASC0 pads
ASC1 pads
SIM pads
GPIO pads
RF antenna pad
Do not use
ADC pad
Supply pads: Other