User's Manual

BGS2-E/BGS2-W Hardware Interface Overview
5.5 Pad Assignment
26
BGS2_HIO_v01.300 Page 25 of 29 2011-03-08
Confidential / Released

Signal pads that are not used should not be connected to an external application.
Table 15: Pad assignments
Pad no. Signal name Pad no. Signal name Pad no. Signal name
1
VMIC 23
Do not use
45 GND
2
EPN1 24
DSR0
46 GND
3
EPP1 25
DTR0
47 GND
4
GND 26
DCD0
48 GND
5
BATT+ 27
GPIO9/I2CDAT
49 GND
6
GND 28
GPIO10/I2CCLK
50 GND
7
ADC1 29
TXD1
51 GND
8
ON 30
RXD1
52 GND
9
GND 31
RTS1
53 BATT+
10 VDIG 32
CTS1
54 GND
11
RXD0 33
EMERG_RST
55 GND
12
CTS0 34
GND
56 GND
13
TXD0 35
V180
57 GND
14
RING0 36
GPIO8
58 GND
15
RTS0
37
GPIO7/PWM1
59 RF_OUT
16
VDDLP
38
GPIO6/PWM2
60 GND
17
CCRST 39
GPIO5/LED
61 GND
18
CCIN
40
GPIO4
62 GND
19
CCIO
41
GPIO3
63 GND
20
CCVCC
42
GPIO2
64 AGND
21
CCCLK
43
GPIO1
65 MICP1
22
V285 44 GND 66 MICN1
67-107 GND
1
1. The pads 67-107 are located at the centre of the module and should be connected to Ground except for
pad 106 that is only required for factory tests. Pad 106 must not be connected to the external application,
but should be left open.