Specifications

Cinterion
®
BGS5 Hardware Interface Overview
2.2 RF Antenna Interface
23
 BGS5_HID_v00.341 2013-09-23
Confidential / Preliminary
Page 21 of 41
2.2.1 Antenna Installation
The antenna is connected by soldering the antenna pad (RF_OUT, i.e., pad #59) and its neigh-
boring ground pads (GND, i.e., pads #58 and #60) directly to the application’s PCB. The anten-
na pad is the antenna reference point (ARP) for BGS5. All RF data specified throughout this
document is related to the ARP.
The distance between the antenna RF_OUT pad and its neighboring GND pads has been op-
timized for best possible impedance. On the application PCB, special attention should be paid
to these 3 pads, in order to prevent mismatch.
The wiring of the antenna connection line, starting from the antenna pad to the application an-
tenna should result in a 50
 line impedance. Line width and distance to the GND plane needs
to be optimized with regard to the PCB’s layer stack.
To prevent receiver desensitization due to interferences generated by fast transients like high
speed clocks on the application PCB, it is recommended to realize the antenna connection line
using embedded Stripline rather than Micro-Stripline technology.
For type approval purposes, the use of a 50
 coaxial antenna connector (U.FL-R-SMT) might
be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible
to BGS5‘s antenna pad.