User's Manual

EHS5-E/EHS5-US Hardware Interface Overview
1 Introduction
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EHS5_HIO_v01.000 Page 6 of 35 2012-11-14
Confidential / Preliminary

1 Introduction
This document
1
describes the hardware of the Cinterion EHS5-E/EHS5-US module. It helps
you quickly retrieve interface specifications, electrical and mechanical details and information
on the requirements to be considered for integrating further components.
1.1 Key Features at a Glance
1. The document is effective only if listed in the appropriate Release Notes as part of the technical
documentation delivered with your Cinterion product.
Feature Implementation
General
Frequency bands EHS5-E:
GSM/GPRS/EDGE: Dual band GSM 900/1800MHz
UMTS/HSPA+: Dual band UMTS 900/2100MHz
EHS5-US:
GSM/GPRS/EDGE: Dual band GSM 850/1900MHz
UMTS/HSPA+: Dual band UMTS 850/1900MHz
GSM class Small MS
Output power (according
to Release 99, V5)
EHS5-E:
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI
Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII
EHS5-US:
Class 4 (+33dBm ±2dB) for EGSM850
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Power supply 3.3V to 4.5V
Operating temperature
(board temperature)
Normal operation: TBD.
Extended operation: TBD.
Physical Dimensions: 27.6mm x 18.8mm x 2.3mm
Weight: approx. 3g
RoHS All hardware components fully compliant with EU RoHS Directive