User's Manual

EHS5-E/EHS5-US Hardware Interface Overview
1.1 Key Features at a Glance
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EHS5_HIO_v01.000 Page 8 of 35 2012-11-14
Confidential / Preliminary

Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and provides the possibility to use an optional module mounting
socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equip-
ment.
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
• Adjustable baud rates: 1,200bps to 921,600bps
• Autobauding: 1,200bps to 230,400bps
• Supports RTS0/CTS0 hardware flow control.
• Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1:
• 4-wire, unbalanced asynchronous interface
• Adjustable baud rates: 1,200bps to 921,60bps
• Supports RTS1/CTS1 hardware flow control
Audio 1 digital interface (PCM)
UICC interface Supported SIM/USIM cards: 3V, 1.8V
GPIO interface GPIO interface with 4 GPIO lines. The GPIO interface is shared with LED
signalling and PWM functionality (available as of Release 2).
I
2
C interface Supports I
2
C serial interface (available as of Release 2)
Antenna interface pads 50
Power on/off, Reset
Power on/off Switch-on by hardware signal ON
Switch-off by AT command
Switch off by hardware signal FAST_SHTDWN instead of AT command
Automatic switch-off in case of critical temperature and voltage conditions.
Reset Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Special features
Real time clock Timer functions via AT commands
Phonebook SIM and phone
TTY/CTM support Integrated CTM modem
Evaluation kit
Evaluation module EHS5-E/EHS5-US module soldered onto a dedicated PCB that can be con-
nected to an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Cinterion Wireless Modules and provide a sample configuration for applica-
tion engineering. A special adapter is required to connect the EHS5-E/
EHS5-US evaluation module to the DSB75.
Feature Implementation