User's Manual

Table Of Contents
Cinterion
®
ELS61-AUS Hardware Interface Description
3.7 Blocking against RF on Interface Lines
73
ELS61-AUS_HID_v00.031 2016-06-03
Confidential / Preliminary
Page 72 of 102
The following table lists for each signal line at the module‘s SMT application interface the EMI
measures that may be implemented.
Table 16: EMI measures on the application interface
Signal name EMI measures Remark
A B C D E
CCIN x x
CCRST x The external capacitor should be not higher
than 10pF. The value of the capacitor
depends on the external application.
CCIO x
CCCLK x
RXD0 xxxxx
TXD0 xxxxx
CTS0 xxxxx
RTS0 xxxxx
GPIO1/DTR0 xxxxx
GPIO2/DCD0 xxxxx
GPIO3/DSR0/SPI_CLKxxxxx
GPIO4/FST_SHDN xxxxx
GPIO5/LED xxxxx
GPIO6/PWM2 xxxxx
GPIO7/PWM1 xxxxx
GPIO8/COUNTER xxxxx
GPIO11-GPIO15 xxxxx
GPIO16/RXD1/MOSIxxxxx
GPIO17/TXD1/MISOxxxxx
GPIO18/RTS1 xxxxx
GPIO19/CTS1/SPI_CSxxxxx
GPIO20 xxxxx
GPIO21 xxxxx
GPIO22 xxxxx
GPIO23 xxxxx
GPIO24/RING0 xxxxx
I2CDAT x x The rising signal edge is reduced with an
additional capacitor.
I2CCLK x x
V180 x x x
VCORE x x x
BATT+
RF
(pad 53) x x Measures required if BATT+
RF
is close to
internal RF antenna -
e.g., 39pF blocking capacitor to ground
BATT+
BB
(pad 204) x x