User's Manual
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
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ELS61-AUS Hardware Interface Description
4.2 Mounting ELS61-AUS onto the Application Platform
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ELS61-AUS_HID_v00.031 2016-06-03
Confidential / Preliminary
Page 76 of 102
4.2 Mounting ELS61-AUS onto the Application Platform
This section describes how to mount ELS61-AUS onto the PCBs, including land pattern and
stencil design, board-level characterization, soldering conditions, durability and mechanical
handling. For more information on issues related to SMT module integration see also [3].
Note: To avoid short circuits between signal tracks on an external application's PCB and vari-
ous markings at the bottom side of the module, it is recommended not to route the signal tracks
on the top layer of an external PCB directly under the module, or at least to ensure that signal
track routes are sufficiently covered with solder resist.
4.2.1 SMT PCB Assembly
4.2.1.1 Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Gemalto characterizations for
lead-free solder paste on a four-layer test PCB and a respectively 110 micron and 150 micron
thick stencil.
The land pattern given in Figure 43 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 2.1.1).
Figure 43: Land pattern (top view)
The stencil design illustrated in Figure 44 and Figure 45 is recommended by Gemalto M2M as
a result of extensive tests with Gemalto M2M Daisy Chain modules.
The central ground pads are primarily intended for stabilizing purposes, and may show some
more voids than the application interface pads at the module's rim. This is acceptable, since
they are electrically irrelevant.