User's Manual

Cinterion
®
ELS61-AUS Hardware Interface Description
4.2 Mounting ELS61-AUS onto the Application Platform
88

ELS61-AUS_HID_v00.031 2016-06-03
Confidential / Preliminary
Page 79 of 102
4.2.3 Soldering Conditions and Temperature
4.2.3.1 Reflow Profile
Figure 46: Reflow Profile
Table 18: Reflow temperature ratings
1
1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-
dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information
on reflow profiles and their optimization please refer to [3].
Profile Feature Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
200°C
60-120 seconds
Average ramp up rate (T
L
to T
P
) 3K/second max.
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
60-90 seconds
Peak package body temperature (T
P
)245°C +0/-5°C
Time (t
P
) within 5 °C of the peak package body
temperature (T
P
)
30 seconds max.
Average ramp-down rate (T
P
to T
L
) 3 K/second max.
Time 25°C to maximum temperature 8 minutes max.
T
L
T
P
t
P
t
L
t
S
Preheat
t to maximum
Time
Temperature
T
Smin
T
Smax