User's Manual
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
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ELS61-AUS Hardware Interface Description
4.2 Mounting ELS61-AUS onto the Application Platform
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ELS61-AUS_HID_v00.031 2016-06-03
Confidential / Preliminary
Page 80 of 102
4.2.3.2 Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
• A maximum module temperature of 240°C. This specifies the temperature as measured at
the module’s top side.
• A maximum duration of 15 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
ELS61-AUS is specified for one soldering cycle only. Once ELS61-AUS is removed from the
application, the module will very likely be destroyed and cannot be soldered onto another ap-
plication.