Cinterion datasheet

Cinterion® PLAS9 Wireless Module
LTE Advanced Connectivity With 3G and 2G Fallback
The Gemalto Cinterion® PLAS9 wireless module is built for
demanding, high perf
ormance IoT applications delivering LTE
advanced connectivity under extreme conditions. With Cat. 6
LTE technology, the PLAS9 enables sizzling data speeds of
300 Mbit/s download and 50 Mbit/s uplink plus seamless
fallback to 3G and 2G networks. Providing reliable coverage
in RF noisy urban areas as well as locations where 4G is still
developing, it is an ideal solution for industrial routers and
gateways, digital signage, industrial mobile computers and
tablets.
Key Features
The PLAS9 provides global coverage and 3G/2G fallback on
just two variants, the PLAS9-X and PLAS9-W. The module’s
innovative RF concept enables extreme performance and
sensitivity and connection stability. MIMO 2x2 antenna
interfaces enable consistent performance and improved data
speeds. With carrier aggregation, PLAS9 delivers enhanced
peak user data rates and optimized use of spectrum for
improved connectivity performance.
Gemalto’s proprietary 156 LGA footprint enables optimized
heat dissipation that prevents warping while allowing the
fr
eedom to select the most beneficial soldering paste and
stencil height suited to each individual application.
Industrial Plus Family Benefits
The PLAS9 wireless module is part of the Cinterion Industrial
Plus family, which leverages the latest wireless standards to
deliver IoT optimized data speeds and Multi Band capabilities
to ensure seamless global coverage. They share a common
footprint providing a seamless migration path to protect your
IoT investment and they are available in local and global
variants including 2G, 3G, CDMA, LTE and LTE Advanced. They
come with full type approval (FTA) and they are certified by
the largest global network operators. All Cinterion modules
are compatible with Gemalto’s comprehensive suite of
solutions, services and platforms that help enterprises
Connect, Secure and Monetize IoT technology.
LTE Advanced
for Demanding
Industrial IoT
Carrier Aggregation
Delivering a major benefit of LTE Advanced technology
, PLAS9 supports
carrier aggregation which allows Mobile Network Operators to combine
two or more carriers into one data channel for enhanced data capacity,
improved peak user performance and optimized use of spectrum.
Future Proof and Multi Design Capability
Extreme durability, long life components and a unique LGA form factor
compatible with past and next generation wireless modules ensures easy
migration between wireless standards from a single design, which helps
to improve Total Cost of Ownership.
Advanced Radio Frequency Design
A highly integrated RF design improves reliability and stability in harsh and
fluctuating conditions providing excellent performance in noisy urban areas.
> Trusted partner to 450+ global MNOs ensures products
evolve in sync with networks and modules are
pre-certified for all global mobile networks
> Core competency in MIM, SIM and eUICC technology
allows simplified integration with modules and lower
Total Cost of Ownership
> Expert design consulting, local market engineering
support and a skilled 24/7 help desk streamline
development and deployment
> Global leader in digital security solutions and platforms
> Experienced provider of software solutions for
Quality of Service and product life cycle management
> Extensive RF test capabilities and GCF/PTCRB
pretests to validate readiness for solution approval
process
Gemalto Advantages:
40 mm
32 mm