Cinterion datasheet

INTERFACES (LGA PADS)
SPECIAL FEATURES
DRIVERS APPROVALS
SPECIFICATIONS
GENERAL FEATURES
> Regional variants
PLAS9-X: Hexa-Band LTE-Advanced FDD: 700 MHz
(B12/B17, B13, B29), 850 MHz (B5),1700 MHz (B4),
1900 MHz (B2)
PLAS9-W: Hendeka-Band LTE-Advanced FDD: 700
MHz (B28A, B28B), 800 MHz (B20), 850 MHz (B5, B18,
B19, B26), 900 MHz (B8), 1800 MHz (B3), 2100 MHz
(B1), 2600 MHz (B7) Quad-Band LTE-Advanced TDD:
1900 MHz (B39), 2300 MHz (B40), 2500 MHz (B41),
2600 MHz (B38)
> LTE Cat. 6DL: max. 300 Mbps, UL: max. 50 Mbps,
2x2 DL MIMO
> HSPA+ DL Cat.24 / UL Cat. 6, Dual CarrierDL:
max. 42 Mbps, UL: max. 5.76 Mbps
> EDGE Class 12 data ratesDL: max. 237 kbps, UL:
max. 237 kbps
> GPRS Class 12 data ratesDL: max. 85.6 kbps, UL:
max. 85.6 kbps
> Data only
> SMS text and PDU mode
> NDIS/USB driver for Microsoft®, Windows 7™,
Windows 8™ and Windows10™
> RIL driver for devices based on Android OS™
> R&TTE, GCF, CE, FCC, IC, PTCRB, UL
> California RoHS
> AT&T, Telstra and Verizon operator approvals
> Other local approvals and certifications on request
> USB 2.0/3.0 interface supports multiple composite
modesand a Linux-/Mac- compliant mode
> Firmware update via USB
> 156 pad LGA mount
> Pads for primary, secondary Antenna
> USB 3.0 super speed (5 Gbps)
> 2 UICC (SIM/MIM) interfaces 1.8V / 3V
> 10 programmable GPIOs including wake-up and
lowcurrent indication, 2 ADCs
Cinterion
®
PLAS9 Features
> LTE (FDD 3GPP Release 9; 2x2 DL-MIMO
> UMTS/HSPA (FDD) 3GPP Release 8; Rx diversity
> GSM/GPRS/EDGE 3GPP Release 6; DARP/SAIC
> SIM Application Toolkit, 3GPP release 99
> Control via AT commands (Hayes, TS 27.007, TS 27.005)
> Supply voltage range 3.3 - 4.2 V, highly optimized for
> minimal power consumption
> Dimension: 40 × 32 × 2,8 mm
> Operating Temperature Range: -40 °C to +95 °
> RoHS, RED and REACH compliant, EuP support