正基科技股份有限公司 SPECIFICATION SPEC. NO.： DATE： REV： 1.4 10.12. 2013 PRODUCT NAME： APPROVED AP6234 CHECKED PREPARED DCC ISSUE NAME AMPAK Technology Inc. Doc. NO: www.ampak.com.
AMPAK AP6234 WiFi 11a/b/g/n +Bluetooth 4.0 SIP Module Spec Sheet AMPAK Technology Inc. Doc. NO: www.ampak.com.
Revision History Date Revision Content 2012/10/18 - Initial released 2012/12/18 Revised By Version Brian 1.0 - Pin definition modify Joe 1.1 2013/01/23 - Pin definition modify Joe 1.2 2013/04/26 - Specification modify Joe 1.3 2013/10/12 - Block Diagram modify Brian 1.4 AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet Contents Contents ................................................................................................................... 2 1. Introduction......................................................................................................... 3 2. Features............................................................................................................... 4 3. Deliverables ..............................................................................................
AP6234 Datasheet 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module, with integrated dual band (2.4GHz/5GHz) IEEE 802.11 a/b/g and single-stream IEEE 802.11n MAC/baseband/radio and Bluetooth 4.0. The integrated module provides SDIO V2.0 Host interface for Wi-Fi, high-speed UART is provided for the Bluetooth Host interface. This compact module is a total solution for a combination of Wi-Fi dual mode + BT4.0 technologies.
AP6234 Datasheet 2. Features IEEE 802.11x Key Features • Dual-band 2.4GHz/5GHz 802.11a/b/g/n. • Single-stream IEEE 802.11n support for 20MHz and 40MHz channels provides PHY layer rates up to 150Mbps. • WLAN host interface options: SDIO v2.0 — up to 50 MHz clock rate • Support a single antenna shared between WLAN and Bluetooth. • Security: WEP, WPS, WPA, WPA2, WMM, WAPI, AES,… Bluetooth Features • Bluetooth V4.0(BLE) Low Energy with provisions for supporting future specifications.
AP6234 Datasheet 3. Deliverables 3.1 Deliverables The following products and software will be part of the product. Module with packaging Evaluation Kits Software utility for integration, performance test. Product Datasheet. Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification.
AP6234 Datasheet 4. General Specification 4.1 General Specification Model Name AP6234 Product Description Supports Wi-Fi dual mode /Bluetoothfunctionalities Dimension L x W x H: 12.0 x 12.0 x 1.5 (typical) mm WiFi Interface SDIOV2.0 BT Interface UART/ PCM Operating temperature -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol VBAT VDDIO Description Min. Max.
AP6234 Datasheet 5. WiFi RF Specification 5.1 2.4GHz & 5GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11a/b/g/n, WiFi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) 5.150 GHz ~ 5.850 GHz (5.0 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch11 5.0GHz：Please see the table1 Modulation 802.11a : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.
AP6234 Datasheet - 18Mbps PER @ -84 dBm, typical - 24Mbps PER @ -82 dBm, typical - 36Mbps PER @ -78 dBm, typical - 48Mbps PER @ -75 dBm, typical - 54Mbps PER @ -73 dBm, typical - 1Mbps PER @ -95 dBm, typical Receive Sensitivity (11b) - 2Mbps @8% PER - 5.
AP6234 Datasheet 128 132 136 140 149 153 157 161 5.725GHz~5.825GHz 5640 5660 5680 5700 5745 5765 5785 5805 6. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard Bluetooth V4.0 of 1, 2 and 3 Mbps. Host Interface UART Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2.400 GHz ~ 2483.
AP6234 Datasheet 7. Pin Assignments 7.1 Pin Outline < TOP VIEW > 7.
AP6234 Datasheet 14 SDIO_DATA_2 I/O SDIO data line 2 15 SDIO_DATA_3 I/O SDIO data line 3 16 SDIO_DATA_CMD I/O SDIO command line 17 SDIO_DATA_CLK I/O SDIO clock line 18 SDIO_DATA_0 I/O SDIO data line 0 19 SDIO_DATA_1 I/O SDIO data line 1 20 GND － Ground connections 21 VIN_LDO_OUT P Internal Buck voltage generation pin 22 VDDIO P I/O Voltage supply input 23 VIN_LDO P Internal Buck voltage generation pin 24 LPO I Low power oscillator clock input (32.
AP6234 Datasheet 8. Dimensions 8.1 Physical Dimensions (Unit: mm) < TOP VIEW > < Side View > < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 8.2 Layout Recommendation (Unit: mm) < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 9. External clock reference External LPO signal characteristics Parameter Nominal input frequency Frequency accuracy Duty cycle Input signal amplitude Signal type Specification Units 32.768 kHz 30 ppm 30 - 70 % 400 to 1800 mV, p-p Square-wave Input impedance >100k <5 pF Clock jitter (integrated over 300Hz – 15KHz) <1 Hz 0.7Vio - Vio V Output high voltage 9.1 SDIO Pin Description The module supports SDIO version 2.
AP6234 Datasheet 10. Host Interface Timing Diagram 10.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable.
AP6234 Datasheet WLAN=OFF, Bluetooth=OFF WLAN=ON, Bluetooth=OFF WLAN=OFF, Bluetooth=ON AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 10.2 SDIO Default Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 10.3 SDIO High Speed Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 11. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times 250℃ 2.5°C/sec 40~70 sec 2.5℃/sec AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 12. Package Information 12.1Label Label A Anti-static and humidity notice Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label . AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 12.2 Dimension AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet B Humidity indicator A Desiccant C C D AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6234 Datasheet 12.3 MSL Level / Storage Condition ※NOTE : Accumulated baking time should not exceed 96hrs AMPAK Technology Inc. Doc. NO: www.ampak.com.
