Specifications

10
Chapter 6 Embedded Specifications
The transmission radio wave module model GX is designed to be used by incorporating it into the Seconic
L-858-D exposure meter. It can be incorporated into other equipment, but it must meet the following
conditions.
6.1 Mechanical conditions
As shown in the figure below, the mechanical conditions for installing the module are as follows:
(CON) must be mechanically adapted. In addition, the space in which the board is installed does not allow
the wireless performance of the antenna installed in the module to be demonstrated simply by providing the
minimum board space.
Concept of required space (clearance)
Do not use metal or resin with an electrostatic shielding property for the casing (casing) of the
parent device to be incorporated. If the module part is covered with metal parts, radio waves
cannot be emitted to the outside.
In order to maximize the wireless performance (communication distance performance) of the
antenna, make sure that there is no object around the antenna part of the module.
Furthermore, even if a resin housing is used, the characteristics will deteriorate if the antenna
part of the module and the case are close to each other. To avoid this, make sure there is a gap of at least
3 mm between the back side of the module (the side without the component/shield case) and the resin
case of the embedded parent device.
Host equipment Casing
Module Board < 1.63mm thick >
Host Board (PCB)
[Module height]
8.44mm
Shield < 2.54mm height >
Header height
1.5mm
Topside – Clearance > 3 mm
Board Clearance ≒5.8 mm