User Guide

All Rights reserved, No Spreading abroad without GOSUNCN Permission 67
ME3630
Hardware Development Guide
 Temperature drop rate: －2～－4℃/S
NOTE:
The test board of furnace temperature must be the main board with the module board mounted on, and
there must be testing points at the position of module board.
Figure 7–4 Module Furnace Temperature Curve Reference Diagram
7.3.5. REFLOW METHOD
If the main board used by customers is a double-sided board, it is recommended to mount the module board at the second
time. In addition, it is preferable for the main board to reflow on the mesh belt when mounting at the first time and the second time.
If such failure is caused by any special reason, the fixture should be also used to make such main board reflow on the track so as to
avoid the deformation of PCB during the reflow process.
7.3.6. MAINTENANCE OF DEFECTS
If poor welding occurs to the module board and main board, e.g., pseudo soldering of the module board and main board, the
welder can directly use the soldering iron to repair welding according to the factory’s normal welding parameters.
7.4. MODULE’S BAKING REQUIREMENTS
The module must be baked prior to the second reflow.
7.4.1. MODULE’S BAKING ENVIRONMENT
The operators must wear dust-free finger cots and anti-static wrist strap under the lead-free and good static-resistant
environment. Refer to the following environment requirements: