Users Manual

15
QR-ZZPJ-017A
SKI.WB638BU.2_668BU
2). ±3MHz offset
-
-48
-40
dBm
3). >±3MHz offset
-
-48
-40
dBm
9. Mechanical,Environmental and Reliability Tests
（机械、环境和可靠性测试）
Test Items
Test Conditions
Qty
Criteria Condition
The packed samples was
10-1
Drop test
tested at below condition:
Drop height:
760mm(0.5~9.5kg）
610mm(9.5~18.5kg)
Drop time: 1x corner, 3x
1xBox
After test, the outer box and inner box
will not been broken by appearance
visual inspection, and the products
should be ok.
edge and 6x face.
10-2
Vibration
test
X-Y-Z direction, first
Frequency changing from
10Hz to 30Hz to
10Hz,amplitude 2.0mm,
5 times vibrations, 5x times
vibration.
1xBox
After test, the outer box and inner box
will not been broken by appearance
visual inspection and the products should
be ok.
1.After soldering, the soldered area must
be covered by a smooth bright solder
Soldering
Soldering
layer, some deficiencies such as a small
10-3
ability test
(Only for SKI
temperature:
245±5℃
3
amount of the pinhole, not wetting are
allowed, but the deficiencies can not be
module)
Soldering duration:
in the same place；
3±0.5S
2. At least 90% of soldered area shall be
covered continuously by the soldering
material.
High
Temperature
After test, the products appearance,
10-4
and
Humidity
Leave samples in 60℃, 90%
RH @ 24 hours
4
power, EVM and frequency error
functional parameter shall be satisfied
Operation
with the test specification.
Test
10-5
Low
Temperature
Operation
Test
Leave samples in -15℃
@24 hours
4
After test, the products appearance,
power, EVM and frequency error
functional parameter shall be satisfied
with the test specification.