Specifications

SKI.WB921A.5
QR-ZZPJ-017A
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24
3). Δf1avg /Δf2avg
0.8
0.98
-
KHz
14. ICFT
-75
±20
+75
KHz
15. Carrier frequency drift
1). One slot packet (DH1)
-25
±15
+25
KHz
2). Two slot packet (DH3)
-40
±15
+40
KHz
3). Five slot packet (DH5)
-40
±15
+40
KHz
4). Max drift rate
-
6
20
KHz/50us
16. TX output spectrum(20dB bandwidth)
-
922
1000
KHz
17. In-Band spurious emission
1). ±2MHz offset
-
-45
-20
dBm
2). ±3MHz offset
-
-48
-40
dBm
3). >±3MHz offset
-
-48
-40
dBm
9. Mechanical,Environmental and Reliability Tests
（机械、环境和可靠性测试）
Test Items
Test Conditions
Qty
Criteria Condition
9-1
Drop test
The packed samples was
tested at below condition:
Drop height:
760mm(0.5~9.5kg）
610mm(9.5~18.5kg)
Drop time: 1x corner, 3x
edge and 6x face.
1xBox
After test, the outer box and inner box
will not been broken by appearance
visual inspection, and the products
should be ok.
9-2
Vibration
test
X-Y-Z direction, first
Frequency changing from
10Hz to 30Hz to
10Hz,amplitude 2.0mm,
5 times vibrations, 5x times
vibration.
1xBox
After test, the outer box and inner box
will not been broken by appearance
visual inspection and the products should
be ok.
9-3
Soldering
ability test
(Only for SKI
module)
Soldering
temperature:
245±5℃
Soldering duration:
3±0.5S
3
1.After soldering, the soldered area must
be covered by a smooth bright solder
layer, some deficiencies such as a small
amount of the pinhole, not wetting are
allowed, but the deficiencies can not be
in the same place；
2. At least 90% of soldered area shall be
covered continuously by the soldering
material.
9-4
High
Temperature
Leave samples in 60℃, 90%
RH @ 24 hours
4
After test, the products appearance,
power, EVM and frequency error