Data Sheet
Table Of Contents
6 Packaging information and production instructions
– Automated optical inspection (AOI) equipment
• (Wave soldering process) Wave soldering devices
– Wave soldering equipment
– Wave soldering xture
– Constant-temperature soldering iron
– Tin bar, tin wire and ux
– Thermal proler
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
• The moisture-proof bag must be placed in an environment in which the
temperature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.
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3. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months has passed since sealing of the bag.
4. Baking settings:
• Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 48 hours for reel package and 12 hours for tray package
• Alarm temperature: 65°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
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