Data Sheet

7 Packaging information and production instructions
tolerance is ±0.1 mm. If you have speci󰍓c requirements on dimensions, specify
them clearly in the datasheet after communication.
7.2 Production instructions
1. The Tuya SMT module should be mounted by the SMT device. After being un-
packed, it should be soldered within 24 hours. Otherwise, it should be put into
the drying cupboard where the RH is not greater than 10%; or it needs to be
packaged under vacuum again and the exposure time needs to be recorded
(the total exposure time cannot exceed 168 hours).
• SMT devices:
– Mounter
– SPI
– Re󰍔ow soldering machine
– Thermal pro󰍓ler
– Automated optical inspection (AOI) equipment
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
• The moisture-proof bag must be placed in an environment where the tem-
perature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.
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