Data Sheet

7 Packaging information and production instructions
measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.
7.3 Recommended oven temperature curve
Set oven temperatures according to the following temperature curve of re󰍔ow sol-
dering. The peak temperature is 245°C.
• A: Temperature axis
• B: Time axis
• C: Liquidus temperature: 217 to 220°C
• D: Ramp-up slope: 1 to 3°C/s
• E: Duration of constant temperature: 60 to 120s; the range of constant tem-
perature: 150 to 200°C
• F: Duration above the liquidus: 50 to 70s
• G: Peak temperature: 235 to 245°C
• H: Ramp-down slope: 1 to 4°C/s
The above curve is just an example of the solder paste SAC305. For more details
about other solder pastes, please refer to Recommended oven temperature curve
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