BP3L Module Datasheet Version: 20210817 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 2 Module interfaces 2.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 4 3 Electrical parameters 9 3.
Contents BP3L is a low-power embedded Bluetooth module that Tuya has developed. Embedded with the Bluetooth communication protocol stack and rich library functions, it mainly consists of a highly integrated Bluetooth chip (PHY6222) and a few peripheral circuits.
1 Product overview 1 Product overview BP3L contains a low-power 32-bit MCU, a Bluetooth LE 5.1/2.4-G Radio, 128-KB to 8-MB flash memory, 64-KB SRAM, and 11 reusable I/O ports. 1.1 Features • Embedded with a low-power 32-bit MCU, which can also function as an application processor. • Operating voltage: 1.8 to 3.6V • Peripherals: 5 PWMs, 1 ADC, 4 GPIOs, and 1 UART • Bluetooth RF features – – – – – – – Bluetooth LE 5.1 The RF data rate can be up to 1 Mbps.
2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint BP3L has 2 lines of pins, 16 pins in total, with a spacing of 2 mm. The BP3L dimensions are 16±0.35 mm (W)×24±0.35 mm (L) ×3.3±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.
2 Module interfaces 2.2 Pin definition The definitions of pins are shown in the following table: Pin No. Symbol I/O type Function 1 RESET_N I/O Reset pin (low active), correspond to RESET_N of the internal IC.
2 Module interfaces Pin No. Symbol I/O type Function 2 P11 AI ADC port, 12 bit/s, which can be reused as a common I/O interface and corresponds to P11 of the IC 3 EN I/O Enabling pin, which is directly connected to the pin RESET_N. During normal operation of the module, do not connect the pin to anything.
2 Module interfaces Pin No. Symbol I/O type Function 7 P32 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P32 of the IC 8 VCC P Power supply pin (Typical value: 3.
2 Module interfaces Pin No.
2 Module interfaces PWM output, please contact Tuya business personnel.
3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -65 150 ℃ VCC Power supply voltage -0.3 3.9 V ESD voltage (human body model) TAMB-25℃ - 2 kV ESD voltage (machine model) TAMB-25℃ - 0.5 kV 3.2 Working conditions Minimum Description value Typical value Maximum value Unit Ta Operating temperature -40 - 105 ℃ VCC Operating voltage 1.8 3.3 3.
3 Electrical parameters Minimum Description value Typical value Maximum value Unit VOL I/O low-level output VSS - VCC*0.1 V VOH I/O high-level output VCC*0.9 - VCC V Parameter 3.
4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.4 GHz ISM band Wireless standard Bluetooth LE 5.1 Data transmission rate 1 Mbps Antenna type PCB antenna 4.
4 RF parameters Parameter Co-channel interference suppression Minimum value - Typical value Maximum value Unit -10 - dB 12 / 26
5 Antenna information 5 Antenna information 5.1 Antenna type BP3L uses the PCB antenna with a gain of 1.09 dBi. 5.2 Antenna interference reduction To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna.
6 Packaging information and production instructions 6 Packaging information and production instructions 6.
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6 Packaging information and production instructions Recommended PCB footprint 16 / 26
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6 Packaging information and production instructions The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication. 6.2 Production instructions 1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours.
6 Packaging information and production instructions • Production-ready temperature after natural cooling: < 36°C • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisturesensitive devices, they are very likely to get damp when exposed beyond the allowable time.
6 Packaging information and production instructions {width=100%} Recommended soldering temperature: Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 °C Soldering temperature 360±20°C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 20 / 26
6 Packaging information and production instructions 6.4 Storage conditions Storage conditions for a delivered module: • The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%. • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. • There is a humidity indicator card (HIC) in the packaging bag.
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7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Packing method BP3L 3600 Tape reel 23 / 26 Modules per reel Reels per carton 900 4
8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
8 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
