Data Sheet

6 Packaging information and production instructions
The default outline dimension tolerance is ±0.35 mm, and the critical dimension
tolerance is ±0.1 mm. If you have speci󰍓c requirements on dimensions, specify
them clearly in the datasheet after communication.
6.2 Production instructions
1. For the Tuya in-line module, wave soldering is most preferred and manual sol-
dering is less preferred. After being unpacked, the module must be soldered
within 24 hours. Otherwise, it must be put into the drying cupboard where
the RH is not greater than 10%; or it needs to be packaged under vacuum
again and record the exposure time (the total exposure time cannot exceed
168 hours).
2. Wave soldering devices and materials:
• Wave soldering equipment
• Wave soldering 󰍓xture
• Constant-temperature soldering iron
• Tin bar, tin wire, and 󰍔ux
• Thermal pro󰍓ler
3. Baking devices:
• Cabinet oven
• Anti-electrostatic and heat-resistant trays
• Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the sealing of the bag.
5. Baking settings:
• Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 48 hours for reel package and 12 hours for tray package
• Alarm temperature: 65°C for reel package and 135°C for tray package
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