Data Sheet

6 Packaging information and production instructions
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the wave
soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond
the allowable time. In this case, if they are soldered at high temperatures,
it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective
measures.
7. To guarantee the quality of products, you must pay attention to the following
items: The amount of soldering 󰍔ux, the height of the wave peak, whether
the tin slag and copper content in the wave soldering tank exceed standards,
whether the window and thickness of the wave soldering 󰍓xture are appropri-
ate, and whether the wave soldering oven temperature curve is appropriate.
6.3 Recommended oven temperature curve and temperature
Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260°C±5°C.
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