Data Sheet

6 Packaging information and production instructions
6.2 Production instructions
1. For the modules that can be packaged with the SMT or in an in-line way, you can
select either of them according to the PCB design solutions of customers. If a
PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB
is designed to be in-line-packaged, package the module in an in-line way. After
being unpacked, the module must be soldered within 24 hours. Otherwise, it
needs to be put into the drying cupboard where the relative humidity is not
greater than 10%; or it needs to be packaged again under vacuum and the
exposure time needs to be recorded (the total exposure time cannot exceed
168 hours).
• (SMT process) SMT devices:
– Mounter
– SPI
– Re󰍔ow soldering machine
– Thermal pro󰍓ler
– Automated optical inspection (AOI) equipment
• (Wave soldering process) Wave soldering devices
– Wave soldering equipment
– Wave soldering 󰍓xture
– Constant-temperature soldering iron
– Tin bar, tin wire and 󰍔ux
– Thermal pro󰍓ler
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
• The moisture-proof bag must be placed in an environment in which the
temperature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.
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