Data Sheet

6 Packaging information and production instructions
3. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months has passed since sealing of the bag.
4. Baking settings:
• Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 48 hours for reel package and 12 hours for tray package
• Alarm temperature: 65°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the re󰍔ow
soldering or wave soldering to solder them. Because these modules are
Level-3 moisture-sensitive devices, they are very likely to get damp when
exposed beyond the allowable time. In this case, if they are soldered at
high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective
24 / 32