Data Sheet

7 Packaging Information and Production Instructions
firmware is burned. If not, vacuum pack the module again. Bake the module
before mounting components to the module.
A. SMT placement equipment
a) Reflow soldering machine
b) Automated optical inspection (AOI) equipment
c) Nozzle with a 6 mm to 8 mm diameter
B. Baking equipment
d) Cabinet oven
e) Anti-static heat-resistant trays
f) Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
1 A. The moisture - proof bag is placed in an environment where the
temperature is below 30 °C and the relative humidity is lower
than 70%.
2 B. The shelf life of a dry -packaged product is six months from the
date when the product is packaged and sealed .
3 C. The package contains a humidity indicator card (HIC).
Figure 4: image.png
3. Bake a module based on HIC status as follows when you unpack the module
package
A. If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecu-
tive hours.
B. If the 30% circle is pink, bake the module for 4 consecutive hours.
C. If the 30% and 40% circles are pink, bake the module for 6 consecutive
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