Data Sheet

7 Packaging Information and Production Instructions
hours.
D. If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecu-
tive hours.
4. Baking settings:
A. Baking temperature: 125±5°C
B. Alarm temperature: 130°C
C. SMT placement ready temperature after natural cooling: < 36°C
D. Number of drying times: 1
E. Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads
are exposed to the air for over three months, they will be oxidized severely and
dry joints or solder skips may occur. Tuya is not liable for such problems and
consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection
and AOI before first SMT placement to determine a proper oven temperature
and component placement method. Draw 5 to 10 modules every hour from
subsequent batches for visual inspection and AOI.
7.3 Recommended Oven Temperature Curve
Please refer to the recommended temperature of wave soldering furnace for setting
the furnace temperature. The peak temperature is 260℃±5℃. The curve of wave
soldering temperature is shown in the following figure:
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